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Application(應用(yòng))
Metal Etching, DSP+ Liquid Film PR S∏♥©®tripper Backside Etc♥✔hing
Thin Wafer Etching with B ←↔"ernoulli Chuck
Performance(工(gōng)藝)
PA adder, <10ea @ 0.2um u%×βλ <3% of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競争優勢)
>97% Chemical Recycle←$ ∏ Rate Max 4 chemicals in one ch∑™δamber
Modularized Platform for 200/300mm Wafer
Safety(安全)
Semi S2/S6/F47 Certification
FM approval material and CO2 fire extinguish$≤er Interlock Mat ♠rix Control
Application(應用(yòng))
Metal Etching, DSP+ Liquid Film PR Strippe↓Ω₹r Backside Etching
Thin Wafer Etching with Bernδ<©oulli Chuck
Performance(工(gōng)藝)
PA adder, <10ea @ 0.2um≥ ¥ u% <3% of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競争優勢)
>97% Chemical Recycle Rat€®e Max 4 chemicals in one chamber
Modularized Platform for 200/300mm Wafe≠∞r
Safety(安全)
Semi S2/S6/F47 Certificati∏←on
FM approval material and CO2 fire ext€↕¥☆inguisher Interlock Matrix Con∏&trol
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