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Application(應用(yòng))
Metal Etching, DSP+ Liquid F♦≤ilm PR Stripper Backsi✔♦≤♠de Etching
Thin Wafer Etching with Bernoulli Chuck
Performance(工(gōng)藝)
PA adder, <10ea @ 0±ε.2um u% <3% of metλ$al etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競争優勢)
>97% Chemical Recycle Rate&n•₹λbsp; Max 4 chemicals→₹ε in one chamber
Modularized Platform for 200/300mm Wafer
Safety(安全)
Semi S2/S6/F47 Certi<πfication
FM approval material and CO2 fire extinguish✘Ωλ←er Interlock Matrix Control
Application(應用(yòng))
Metal Etching, DSP+ Liquid Film PR←∏¥ Stripper Backside Etching
Thin Wafer Etching with Bernoulli Chuck
Performance(工(gōng)藝)
PA adder, <10ea @ 0.2um₽♥ u% <3% of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競争優勢)
>97% Chemical Recycle Rate Max 4 chemica ¶≥₽ls in one chamber
Modularized Platform for 20∞≤®0/300mm Wafer
Safety(安全)
Semi S2/S6/F47 Certification
FM approval material and CO2 fi$>re extinguisher Interlock Mat✔φrix Control
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