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Application(應用(yòng))
Metal Etching, DSP+ Liquid Film PR S π"✘tripper Backside Etching
Thin Wafer Etching with Beγ★§rnoulli Chuck
Performance(工(gōng)藝)
PA adder, <10ea @Ω≈>← 0.2um u% <3% of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競争優勢)
>97% Chemical Recycle Rate Max 4 chem'✔→$icals in one chamber
Modularized Platform for 200/300mm ∞↔Wafer
Safety(安全)
Semi S2/S6/F47 Certification
FM approval material and←≈ CO2 fire extinguisher Interlock∞↕↑ Matrix Control
Application(應用(yòng))
Metal Etching, DSP+ L≥♥λ¥iquid Film PR Stripper Backside Et$>ching
Thin Wafer Etching wiΩ✘★σth Bernoulli Chuck
Performance(工(gōng)藝)
PA adder, <10ea @ 0.2um u% <3% oπ€₽f metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競争優勢)
>97% Chemical Recycle RateΩ∞₩ Max 4 chemicals in one ch★εσamber
Modularized Platform for 200/300mm&≤≥ε Wafer
Safety(安全)
Semi S2/S6/F47 Certifica →πtion
FM approval material and CO2 fire extinguisher±₹®¥ Interlock Matrix Control
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