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Application(應用(yòng))
Metal Etching, DSP+ L$₽©•iquid Film PR Stripper&nbs✘¥p; Backside Etching
Thin Wafer Etching with Bernoulli Chuck
Performance(工(gōng)藝)
PA adder, <10ea @ 0.2um u% &l♦≥♣t;3% of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競争優勢)
>97% Chemical Recycle Rate Max 4 chemi♥cals in one chamber
Modularized Platform for ★↔¶200/300mm Wafer
Safety(安全)
Semi S2/S6/F47 Certif∞™∑ication
FM approval material and CO2 fire exting∑★uisher Interlock Matrix ♥∏Control
Application(應用(yòng))
Metal Etching, DSP+ Liquid Film PΩR Stripper Backside Etching
Thin Wafer Etching with Bernoulli Chuck
Performance(工(gōng)藝)
PA adder, <10ea @ 0.2um u% <3%±←←$ of metal etching
SECS GEM, RMS, iEMS, FDC
Scheduler
Advantage(競争優勢)
>97% Chemical Recycle Rate  ¶; Max 4 chemicals in one cha$£mber
Modularized Platform for 200/300mm Waferβ
Safety(安全)
Semi S2/S6/F47 Certification
FM approval material and CO2 fire extinguis&¶•her Interlock Matri₹ x Control
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